Thursday, December 5th 9:00am-3:00pm
University of Buffalo, Room: TBD
Dr. Krishna Rajan Dept. of Materials Design & Innovation University at Buffalo
Dr. D. Scott Holmes IRDS CEQUIP Lead
This roadmapping workshop will provide a perspective on where and how AI plays a critical role in advancing materials driven innovation in microelectronics fabrication and how this can be leveraged for a future NSF Engine. Some of the issues we will consider include: how to harness AI for multiscale characterization, integrating sustainability metrics into the design of materials with enhance functionality and linking materials discovery to device performance. The role of harnessing materials science informed AI in the development of databases and digital twins is also discussed.
This meeting has been canceled, and incorporated into the January partner meeting.
Click here for more information and to register for the new date.